Surface mount and BGA pad repair are routine operations performed daily at Circuit Technology Center. Damaged pads are replaced with specially fabricated, adhesive backed pads that are thermally bonded to the board surface.
This reliable
IPC Recommended Procedure eliminates the need for using messy liquid epoxies to bond replacement pads in place. We stock thousands of different sizes and shapes of replacement pads.
Refer to the following procedures for detailed information. |
| SMT pad repair using the IPC recommended method. |
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| Typical damaged surface mount pads. |
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